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Wednesday, December 17, 2014

Stanford High Rise Chip

In CWorld: New three dimensional design.  Potential for IoT and Big Data applications.

" ... Stanford University researchers have built a multi-layered "high-rise" chip that could significantly outperform traditional computer chips, taking on the hefty workloads that will be needed for the Internet of Things and big data.

Using nanotechnology, the new chips are built with layers of processing on top of layers of memory, greatly cutting down on the time and energy typically needed to move information from memory to processing and back. ... " 

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