BBCube 3D: A Breakthrough in Semiconductor Integration, Data Transmission

BBCube 3D: A Breakthrough in Semiconductor Integration, Data Transmission

Tokyo Tech News (Japan)

June 29, 2023

The Bumpless Build Cube 3D (BBCube3D) technology designed by scientists at Japan's Tokyo Institute of Technology (Tokyo Tech) and tech developer Hitachi could potentially improve the three-dimensional integration of processing units (PUs) and memory chips. The researchers facilitated 3D connectivity between PUs and dynamic random access memory (DRAM) by stacking PU dies atop multiple DRAM layers interconnected by through-silicon vias (TSVs). BBCube 3D owes its improved electrical performance to low parasitic capacitance and resistance to the TSVs, overall compactness, and the absence of solder microbumps. Tokyo Tech's Takayuki Ohba said the technology "has the potential to achieve a bandwidth of 1.6 terabytes per second, which is 30 times higher than DDR5 [Double Data Rate 5 Synchronous DRAM] and four times higher than HBM2E [High Bandwidth Memory 2E]."

Smart Hearing Houses

Virtual Assistants in the smart home are attentive in their hearing.  Why not have the entire house create a hearing and sensing network?  This could be done my connecting existing sensory devices, or built into the house itself, or contained in home appliances.  Here is an interesting play.   Following In Bloomberg: 

Building a House That Can Hear

Audio Analytic, a startup in Cambridge, England, has made it possible for home appliances to hear windows breaking and babies crying.  ... 

As artificial intelligence software continues to advance at an alarming rate, it keeps popping up in new places. A startup based in Cambridge, England, called Audio Analytic, for example, has found a way to inject AI code into smart home devices such as the Amazon Echo and Nest’s smoke alarms. The software can detect the sound of a window breaking or a baby crying and notify the homeowner about the situation.  ... "